BGA Reballing Stencils, 130pcs BGA Universal Reballing Rework ...

4.6 · 38 reviews

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$51

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About this item

This kit gives you 130 stainless steel BGA reballing stencils covering 6 solder ball sizes from 0.35mm to 0.76mm, so you're ready for nearly any chip you're reworking. Each stencil holds up under hot air rework heat without deforming, and the size is marked right on it for quick selection. Ideal for reballing north-south bridge chips, graphics cards, and other BGA ICs on laptops, desktops, and communication boards.

Set of 130 BGA reballing stencils in 6 sizes: 3x 0.35mm, 2x 0.4mm, 7x 0.45mm, 35x 0.5mm, 60x 0.6mm, 23x 0.76mm solder ball sizes
Built from stainless steel with precise mesh thickness for clean, accurate solder ball placement
Withstands heat from hot air rework stations without warping or losing shape
Size markings printed right on each stencil so you grab the correct one fast
Works for laptop, desktop, and communication board north-south bridge chips, plus graphics card BGA ICs
Total weight approx. 268g / 9.5oz, silver stainless steel finish

Specifications

ASIN: B07RQQMY8J
Item Weight: 7.6 ounces
Customer Reviews: 4.6 4.6 out of 5 stars (38) 4.6 out of 5 stars
Best Sellers Rank: #106,272 in Industrial & Scientific (See Top 100 in Industrial & Scientific) #266 in Soldering Stations
Item model number: Hongzernf2c94usiw
Product Dimensions: 3.94 x 1.97 x 1.97 inches
Date First Available: May 14, 2019